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Japan silicon edge grinding equipment

Apr 30, 2021

Fukuno Plant. 641 Nojiri, Nanto City, Toyama 939-1502, Japan Tel +81-763-22-2165 Fax +81-763-22-6218

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  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    ACCRETECH-TOKYO SEIMITSU is primarily engaged in the sale of: equipment such as wafer slicing machines that cut silicon crystal ingots into silicon substrates called wafers, upon which semiconductor processing is conducted; and, wafer edge grinding machines that

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    [ Head Office / Annaka factory ] 2993 Gobara,Annaka,Gunma,379-0315 JAPAN. TEL:027-385-5800 FAX:027-385-5880

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Polish Grinders. Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system. Polish Grinder: PG3000RMX. Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in massproducing. Catalog PDF (728.7KB)

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Jun 30, 2021 Sekiya’s grandfather founded the company in 1937 to cash in on demand for grinding equipment amid Japan’s pre-war military build-up. After the war, Disco’s abrasive wheels found use in

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Our product portfolio includes grinding, polishing and CMP equipment used to manufacture substrates and devices for the global semiconductor industry. The Company has leveraged its significant intellectual property portfolio to develop the new flagship 6EZ Silicon Carbide Polisher, which, alongside the 7AF-HMG Silicon Carbide Grinder, provides

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Tokyo, Japan) and G&N surface grinder (Nanogrinder, Grinding Machines Nuernberg, Inc., Erlangen, Germany). During grinding, deionized (purified) water is being used to cool the grinding wheel and the wafer surface. Surface grinding can be used for grinding wire-sawn wafers, to

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Grinding and Polishing Equipment. ... A wide range of consumables and accessories for plane and fine grinding to ensure exceptional edge retention and reproducibility. Polishing. ... Fast curing two-part silicon rubber compound for flexible high resolution 3D replicas. For the 50 ml system, the hand-operated dispensing gun and the static mixing

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Grinding and Polishing Guide. Grinding should commence with the finest grit size that will establish an initially flat surface and remove the effects of sectioning within a few minutes. An abrasive grit size of 180-240 [P180-P280] is coarse enough to use on specimen surfaces sectioned by an abrasive wheel. Hack-sawed, bandsawed, or other rough

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    2.1: Grinding Grinding can be defined as the rapid removal of material from a sample either to reduce it to a suitable size or to remove large irregularities from the surface. The grinding wheel or plate typically rotates at a high speed (around 200-1000rpm) and a coarse, bonded abrasive ( 40 m) is used

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    US5658189A US08/527,348 US52734895A US5658189A US 5658189 A US5658189 A US 5658189A US 52734895 A US52734895 A US 52734895A US 5658189 A US5658189 A US 5658189A Authority US United States Prior art keywords wafer grinding polishing grinding wheel edge Prior art date 1994-09-29 Legal status (The legal status is an assumption and is not a legal conclusion

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    grinding machines can be classified as utility grinding machines, cylindrical grinding machines. and surface ... Its thin edge can be inserted into narrow places, and it is ... Most grinding wheels are made of silicon carbide or aluminum oxide, both of which are artificial (manufactured) abrasives. Silicon carbide is extremely hard but brittle

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    This paper presents a new grinding method in which a silicon wafer rotating at high speed is ground by a cup wheel that is fed inward continuously. The paper compares experimental results by this

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Auto Solar Panel Making Machine PV Module Glass Edge Grinding Machine Specifications: Model YEPC6M1300 YEPC6M1600 YEPC6M2000 YEPC6M2500 Max. Width of Glass 1300mm 1600mm 2000mm 2500mm Min. Size of Glass 120

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    In small diamter wafering process, wafers are sliced one by one from the ingot using a rotating diamond inner peripheral blade. The image shown on left is slicing with wire-saw. Beveling (Peripheral Rounding) The periphery of a wafer is ground with a diamond tool to attain the required product diameter

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    TOP. Introducing the Edge Grinder series that brings NC-controlled grinding to the chamfering process on silicon and other wafers for the first time in the world. Besides the WBM series, in wide use and still regarded as the industry standard, we will be releasing the

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Polishing-affiliated process such as laser marking, edge-grinding, glass cutting, dicing, chamfering, metal vapor deposition, etc. are also offered with high precision. Surface processing technology such as epitaxial growth, etching, etc. are also materialized in our process with highly sophisticated level

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    Jun 29, 2021 (Bloomberg) -- One Japanese company that got its start making grinding wheels for machinery more than 80 years ago believes it holds the key to helping manufacturers create ever slimmer and more powerful semiconductors to power next-generation

  • japan silicon edge grinding equipment
    japan silicon edge grinding equipment

    2006 SCHIATTI ANGELO FPS50 M3 EDGE GRINDER (VERTICAL) [GM-010231] Manufacturer: Schiatti Angelo SCHIATTI ANGELO FPS50 M3 Straight Edge Grinder / Polisher (10) Wheel (Spindles) Straight grinding machine for the processing of flat edge and arris